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d a t a sh eet preliminary speci?cation file under integrated circuits, ic02 1997 may 16 integrated circuits saa5700 chinese character system teletext (ccst) decoder
1997 may 16 2 philips semiconductors preliminary speci?cation chinese character system teletext (ccst) decoder saa5700 features acquisition and display of the 625-line pal ccst chinese standard for teletext, with chinese and latin character sets supports multiple dram sizes: 256k 4 bits, 1m 4 bits, 4m 4 bits and 2 1m 4 bits with an additional decoder/demultiplexer ic acquires and stores in background up to (typically) 400 pages with 1m 4 bits external dram ccst fastext, with capability of displaying chinese characters on fastext prompt row meshing for reduced contrast video background in subtitles and boxes full line and screen colour to all edges of screen supports 625-line 50/100 hz display modes scan-locked and stand-alone sync modes; supports video-locked sync modes with external pll easy control via high level i 2 c-bus safari commands sync mode switching and picture centring via i 2 c-bus safari commands supports external decryption unit for encrypted data. general description the saa5700 is a chinese teletext decoder suitable for tv and multimedia applications. it incorporates all the data slicing, acquisition and display circuitry on-chip, as well as the logic for memory management. an external dram is used to store the currently displayed page and also the precaptured teletext pages. an external rom is used to store the ideographic chinese character set. there is a high level software interface with easy commands for the control of the decoder. control is achieved via the i 2 c-bus. the device is available in a qfp64 package. ordering information type number package name description version SAA5700GP qfp64 plastic quad ?at package; 64 leads (lead length 1.95 mm); body 14 20 2.8 mm sot319-2
1997 may 16 3 philips semiconductors preliminary speci?cation chinese character system teletext (ccst) decoder saa5700 block diagram fig.1 block diagram. handbook, full pagewidth mgg539 sync separator data acquisition packet buffer memory interface oscillator and clock generator acquisition timing processor block display interface display timing front end display section saa5700 bus 35 4 5 10 6 7 27 42 53 44 54, 41, 40, 38 to 36, 32 to 28 55 to 58, 52, 51, 47, 46 25 18 17 24 23 22 21 62 61 60 63 59 64 1 33 48 49 2 19 20 9 8 14,16, 26 12 mhz rd7 to rd0 ra10 to ra0 we cas ras romcs i ref ref + stn cvbs black v ddd1 v ss1 v ddd2 v ss2 v ss3 v ddx v sso v dda v ssa v ss oscout oscin reset dcl dda scl sda r g b blan lfb ffb/sttv odd/even 24 mhz 6 mhz
1997 may 16 4 philips semiconductors preliminary speci?cation chinese character system teletext (ccst) decoder saa5700 pinning symbol pin i/o description oscout 1 o oscillator output to crystal v ss3 2 ground ground for i/o pad buffers connect to v ss ; internally connected to v ss1 and v ss2 n.c. 3 - not connected black 4 i/o black level sample and hold capacitor; 100 nf to v ssa cvbs 5 i video signal input; 100 nf series capacitor, 250 w source impedance maximum, reference to v ssa stn 6 i/o adc current reference decoupling; 100 nf to v ssa i ref 7 i current reference input; 10 k w to v ssa v ssa 8 ground 0 v power supply; analog v dda 9 supply +5 v power supply; analog ref+ 10 i adc voltage reference decoupling; 100 nf to v ssa i.c. 11 - internally connected; do not use i.c. 12 - internally connected; do not use i.c. 13 - internally connected; do not use v ss 14 ground connect to v ss for normal use n.c. 15 - not connected v ss 16 ground connect to v ss for normal use lfb 17 i scan line ?yback input (hsync) ffb/sttv 18 i/o scan ?eld ?yback input (vsync)/sync to tv output v ddx 19 supply +5 v power supply; connect to v dd for normal use v sso 20 ground output stage current return and 0 v r 21 o analog red output g 22 o analog green output b 23 o analog blue output blan 24 o fast blanking (vds) odd/even 25 o frame rate signal for hardware de-interlace (frame) v ss 26 ground connect to v ss for normal use romcs 27 o chip select (address decode) for rom ra0 28 o bit 0 of address to dram, rom and ic ra1 29 o bit 1 of address to dram, rom and ic ra2 30 o bit 2 of address to dram, rom and ic ra3 31 o bit 3 of address to dram, rom and ic
1997 may 16 5 philips semiconductors preliminary speci?cation chinese character system teletext (ccst) decoder saa5700 ra4 32 o bit 4 of address to dram, rom and ic v ss1 33 ground 0 v power supply digital; connected internally to v ss2 and v ss3 n.c. 34 - not connected v ddd1 35 supply +5 v power supply digital; connected internally to v dd2 ra5 36 o bit 5 of address to dram, rom and ic ra6 37 o bit 6 of address to dram, rom and ic ra7 38 o bit 7 of address to dram, rom and ic n.c. 39 - not connected ra8 40 o bit 8 of address to dram, rom and ic ra9 41 o bit 9 of address to dram, rom and ic ras 42 o row address strobe to dram; active low n.c. 43 - not connected we 44 o write enable to dram and ic; active low i.c. 45 - internally connected; do not use rd0 46 i/o bit 0 of data bus to/from dram, rom and ic rd1 47 i/o bit 1 of data bus to/from dram, rom and ic v ddd2 48 supply +5 v power supply digital; connected internally to v dd1 v ss2 49 ground 0 v power supply digital; connected internally to v ss1 and v ss3 n.c. 50 - not connected rd2 51 i/o bit 2 of data bus to/from dram, rom and ic rd3 52 i/o bit 3 of data bus to/from dram, rom and ic cas 53 o column address strobe to dram; active low ra10 54 o bit 10 of address to dram, rom and ic rd7 55 i/o bit 7 of data bus to/from dram, rom and ic rd6 56 i/o bit 6 of data bus to/from dram, rom and ic rd5 57 i/o bit 5 of data bus to/from dram, rom and ic rd4 58 i/o bit 4 of data bus to/from dram, rom and ic reset 59 i chip/processor reset input (active high) dda 60 i/o bidirectional serial data to/from optional decryptor scl 61 i primary i 2 c-bus serial clock input sda 62 i/o primary i 2 c-bus serial data dcl 63 o serial clock to optional decryptor oscin 64 i oscillator input from crystal/external clock input symbol pin i/o description
1997 may 16 6 philips semiconductors preliminary speci?cation chinese character system teletext (ccst) decoder saa5700 fig.2 pin configuration. handbook, full pagewidth saa5700 mgg538 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 oscout v ss3 n.c. black cvbs stn i ref v ssa v dda ref + i.c. i.c. i.c. v ss n.c. v ss lfb ffb/sttv v ddx rd2 n.c. v ss2 v ddd2 rd1 rd0 i.c. we n.c. ras ra9 ra8 n.c. ra7 ra6 ra5 v ddd1 n.c. v ss1 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 20 21 22 23 24 25 26 27 28 29 30 31 32 64 63 62 61 60 59 58 57 56 55 54 53 52 oscin dcl sda scl dda reset rd4 rd5 rd6 rd7 ra10 cas rd3 v sso r g b blan odd/even v ss romcs ra0 ra1 ra2 ra3 ra4
1997 may 16 7 philips semiconductors preliminary speci?cation chinese character system teletext (ccst) decoder saa5700 high level i 2 c-bus command interface this device communicates via the i 2 c-bus using the safari protocol. the following section indicates the protocol which is supported by this decoder. user commands table 1 lists the ccst user command codes in tv mode; table 2 lists the ccst user command codes in text mode. table 1 tv mode user command codes function id (hex) function 00 - 01 - 02 - 03 picture 04 status 05 - 06 - 07 time 08 - 09 - 0a - 0b - 0c - 0d - 0e - 0f - 10 tv programme 0 11 tv programme 1 12 tv programme 2 13 tv programme 3 14 tv programme 4 15 tv programme 5 16 tv programme 6 17 tv programme 7 18 tv programme 8 19 tv programme 9 1a tv programme 10 1b tv programme 11 1c tv programme 12 1d tv programme 13 1e tv programme 14 1f tv programme 15 table 2 text mode user command codes function id (hex) function 20 red 21 green 22 yellow 23 subtitle 24 status 25 hold toggle 26 reveal 27 cancel toggle 28 index 29 - 2a browse 2b reveal set toggle 2c - 2d previous 2e display chinese prompt 2f subcode toggle 30 1 31 2 32 3 33 4 34 5 35 6 36 7 27 8 28 9 29 0 3a size 3b up 3c down 3d cyan 3e mix 3f text
1997 may 16 8 philips semiconductors preliminary speci?cation chinese character system teletext (ccst) decoder saa5700 extended commands the extended commands for the decoder are listed in table 3. table 3 extended commands object function parameter length (bytes) parameters name id (hex) name id (hex) input output input output display 48 set sync mode 04 1 - sync mode none set display position 08 4 - row start, line start none processor 52 restart software 06 3 - fffffch none memory and osd 53 read packet 03 1 [+1] 40 packet number, [designation code] packet data write packet 06 1 +40 - packet number, packet data none osd mode on 08 0 - none none osd mode off 0a 0 - none none osd display 0e 0 - none none clear display page 10 0 - none none
1997 may 16 9 philips semiconductors preliminary speci?cation chinese character system teletext (ccst) decoder saa5700 limiting values in accordance with the absolute maximum rating system (iec 134). characteristics t amb = - 20 to +70 c and v ddn = 4.5 to 5.5 v; unless otherwise indicated. symbol parameter min. max. units v ddd1 digital supply voltage 1 - 0.3 +6.5 v v ddd2 digital supply voltage 2 - 0.3 +6.5 v v dda analog supply voltage - 0.3 +6.5 v v ddx supply voltage x - 0.3 +6.5 v v i(max) maximum input voltage (any input) - 0.3 v dd + 0.5 v v o(max) maximum output voltage (any output) - 0.3 v dd + 0.5 v d v ddx-ddn supply voltage difference between v ddx , v ddd1 , v ddd2 and v dda - 0.25 v i i(d) diode input current (dc) - 20 ma i o(d) diode output current (dc) - 20 ma i o(max) maximum output current (any output) - 10 ma t stg storage temperature - 55 +125 c t amb operating ambient temperature - 20 +70 c symbol parameter conditions min. typ. max. unit power supplies v ddd1 digital supply voltage 1 4.5 5.0 5.5 v i ddd1 digital supply current 1 - 95 140 ma v ddd2 digital supply voltage 2 4.5 5.0 5.5 v i ddd2 digital supply current 2 - 2.4 6.5 ma v dda analog supply voltage 4.5 5.0 5.5 v i dda analog supply current - 40 53 ma v ddx supply voltage x 4.5 5.0 5.5 v i ddx supply current x - 32 40 ma i dd(tot) total supply current - 170 240 ma inputs cvbs v sync sync amplitude 0.1 0.3 0.6 v v bur(p-p) colour burst amplitude (peak-to-peak value) 0 0.3 4 v v i(video)(p-p) video input amplitude (peak-to-peak value) 0.7 1.0 1.4 v v i(data) teletext data amplitude 0.29 0.46 0.71 v z source source impedance -- 250 w v sw(i) input switching level of sync separator 1.6 1.9 2.2 v c i input capacitance -- 10 pf
1997 may 16 10 philips semiconductors preliminary speci?cation chinese character system teletext (ccst) decoder saa5700 i r ef r iref resistor to v ssa - 10 - k w v iref voltage on i ref pin v dd =5v - 2.3 - v r eset v il low-level input voltage - 0.3 - +0.8 v v ih high-level input voltage 2.0 - v dd + 0.5 v i li input leakage current v i = 0 to v dd - 10 - +10 m a lfb (hsync) v il low-level input voltage - 0.3 - +0.6 v v ih high-level input voltage 2.4 - v dd + 0.5 v v hys input hysteresis voltage - 0.7 - v i li input leakage current v i = 0 to v dd - 10 - +10 ma i i(max) maximum input current note 1 - 1 - +1 m a t w(lfb) lfb input pulse width 200 -- ns t i(r) input rise time -- 100 ns t i(f) input fall time -- 100 ns ffb (vsync) v il low-level input voltage - 0.3 0.3v dd - v v ih high-level input voltage 0.7v dd v dd + 0.5 - v i li input leakage current v i = 0 to v dd - 10 +10 -m a i i(max) maximum input current - 1+1 - ma t w(ffb) ffb input pulse width 1 -- display lines t i(r) input rise time -- 500 ns t i(f) input fall time -- 500 ns input/outputs ref+ c ref+ decoupling capacitor to v ssa - 100 - nf v ref+ dc voltage on ref+ 2.3 2.5 2.7 v oscin and oscout v osc(p-p) oscillation amplitude (peak-to-peak value) - v dd - v c i input capacitance -- 10 pf f osc oscillator frequency - 6.0 - mhz d f osc oscillator frequency tolerance - 500 - ppm black c black storage capacitor to v ssa - 100 - nf v black black level for nominal sync amplitude 1.75 2.0 2.25 v symbol parameter conditions min. typ. max. unit
1997 may 16 11 philips semiconductors preliminary speci?cation chinese character system teletext (ccst) decoder saa5700 i li input leakage current v i = 0 to v dd - 10 - +10 m a stn c stn decoupling capacitor to v ssa - 100 - nf v stn dc voltage on stn 0.95 1.1 1.25 v scl ( open - drain ) f scl scl clock frequency 0 - 400 khz v il low-level input voltage - 0.5 - +1.5 v v ih high-level input voltage 3.0 - v dd + 0.5 v v ol low-level output voltage i ol = 3 ma 0 - 0.4 v i ol = 6 ma 0 - 0.6 v i li input leakage current v i = 0 to v dd - 10 - +10 m a c i input capacitance -- 10 pf c l load capacitance -- 400 pf t i(r) input rise time f scl = 100 khz; note 2 50 - 1000 ns f scl = 400 khz; note 2 50 - 300 ns t i(f) input fall time f scl = 100 khz; note 3 50 - 300 ns f scl = 400 khz; note 3 50 - 300 ns t o(f) output fall time 3 to 1.5 v; i ol =3ma 50 - 250 ns sda ( open - drain ) v il low-level input voltage - 0.5 - +1.5 v v ih high-level input voltage 3.0 - v dd + 0.5 v v ol low-level output voltage i ol = 3 ma 0 - 0.4 v i ol = 6 ma 0 - 0.6 v i li input leakage current v i = 0 to v dd - 10 - +10 m a c i input capacitance -- 10 pf c l load capacitance -- 400 pf t i(r) input rise time f scl = 100 khz; note 2 50 - 1000 ns f scl = 400 khz; note 2 50 - 300 ns t i(f) input fall time f scl = 100 khz; note 3 50 - 300 ns f scl = 400 khz; note 3 50 - 300 ns t o(f) output fall time 3 to 1.5 v; i ol =3ma 50 - 250 ns symbol parameter conditions min. typ. max. unit
1997 may 16 12 philips semiconductors preliminary speci?cation chinese character system teletext (ccst) decoder saa5700 dcl and dda ( internal pull - down resistor ) v il low-level input voltage - 0.3 - +0.8 v v ih high-level input voltage 2.0 - v dd + 0.5 v v ol low-level output voltage i ol = 1.6 ma 0 - 0.4 v i li input leakage current v i = 0 to v dd - 10 - +10 m a c i input capacitance -- 10 pf c l load capacitance -- 50 pf t o(f) output fall time 2.2 to 0.6 v; i ol = 1.6 ma -- 10 ns rd7 to rd0 v il low-level input voltage - 0.3 - +0.8 v v ih high-level input voltage 2.0 - v dd + 0.5 v v ol low-level output voltage i ol = 1.6 ma 0 - 0.4 v v oh high-level output voltage i oh = - 0.2 ma 2.4 - v dd v i li input leakage current v i = 0 to v dd - 10 - +10 m a c i input capacitance -- 10 pf c l load capacitance -- 30 pf t o(r) output rise time into c l 0.6 to 2.2 v -- 10 ns t o(f) output fall time into c l 2.2 to 0.6 v -- 10 ns outputs cas v ol low-level output voltage i ol = 1.6 ma 0 - 0.4 v v oh high-level output voltage i oh = - 0.2 ma 2.4 - v dd v c l load capacitance -- 50 pf t o(r) output rise time into c l 0.6 to 2.2 v -- 5ns t o(f) output fall time into c l 2.2 to 0.6 v -- 5ns ras, we, romcs, ra10 to ra0 v ol low-level output voltage i ol = 1.6 ma 0 - 0.4 v v oh high-level output voltage i oh = - 0.2 ma 2.4 - v dd v c l load capacitance -- 50 pf t o(r) output rise time into c l 0.6 to 2.2 v -- 10 ns t o(f) output fall time into c l 2.2 to 0.6 v -- 10 ns odd/even (frame) v ol low-level output voltage i ol = 1.6 ma 0 - 0.4 v v oh high-level output voltage i oh = - 0.2 ma 2.4 - v dd v c l load capacitance -- 200 pf t o(r) output rise time into c l 0.6 to 2.2 v -- 200 ns t o(f) output fall time into c l 2.2 to 0.6 v -- 200 ns symbol parameter conditions min. typ. max. unit
1997 may 16 13 philips semiconductors preliminary speci?cation chinese character system teletext (ccst) decoder saa5700 notes 1. this current is the maximum allowed into the inputs when line and field flyback signals are connected to these inputs. an external series resistor must be used to limit the input currents to 1 ma. 2. measured from v il(max) to v ih(min) . 3. measured from v ih(min) to v il(max) . sttv v sttv vcs, tcs amplitude 0.2 0.3 0.4 v v sttv(dc) nominal dc voltage 1.85 2.0 2.15 v i o(drive) output drive -- 3ma r, g and b i ol low-level output current (black level) - 10 - +10 m a i oh high-level output current (full intensity) v ddx = 5 v 5.1 6.0 6.9 ma r l load resistance to v sso for nominal 1v (p-p) output - 160 -w c l load capacitance -- 20 pf t o(r) output rise time 10% to 90% -- 15 ns t o(f) output fall time 90% to 10% -- 15 ns blan (vds) v oh high-level output voltage i oh = - 2ma v dd - 0.25 - v dd v v ol low-level output voltage i ol = 2 ma 0 - 0.2 v c l load capacitance -- 50 pf t o(r) output rise time 10% to 90% -- 15 ns t o(f) output fall time 90% to 10% -- 15 ns t sk skew delay between outputs r,g,b and blan -- 15 ns symbol parameter conditions min. typ. max. unit
1997 may 16 14 philips semiconductors preliminary speci?cation chinese character system teletext (ccst) decoder saa5700 table 4 i 2 c-bus timing (see note 1 and fig.3) note 1. the i 2 c-bus interface pins sda and scl may pull the data and clock lines below 3 v while the power supply v dd is in the range 0.4 to 0.8 v. outside this range, the sda and scl pins behave correctly. symbol parameter 100 khz 400 khz unit min. max. min. max. f scl scl clock frequency 0 100 0 400 khz t low low period of the scl clock 4.7 - 1.3 -m s t high high period of the scl clock 4.0 - 0.6 -m s t su;dat data set-up time 250 - 100 -m s t hd;dat date hold time 0 - 0 -m s t su;sto set-up time clock high to stop 4.7 - 0.6 -m s t buf set-up time stop to start 4.7 - 1.3 -m s t hd;sta start hold time 4.0 - 0.6 -m s t su;sta set-up time clock rising edge to start 4.7 - 0.6 -m s t r rise time of both sda and scl signals - 1000 - 300 ns t f fall time of both sda and scl signals - 300 - 300 ns fig.3 primary i 2 c-bus timing. handbook, full pagewidth mgg541 t high t low t r t f t su;sta t hd;sta t su;dat t hd;dat t su;sto t buf scl sda
1997 may 16 15 philips semiconductors preliminary speci?cation chinese character system teletext (ccst) decoder saa5700 dram interface timing (see note 1 and fig.4) note 1. based on a display clock frequency of 24 mhz, maximum 24 mhz + 500 ppm. symbol parameter min. typ. max. unit t cy(ras) ras cycle time - 375 - ns t pch(ras) ras precharge time 60 -- ns t h(cas) cas hold time 80 -- ns t d(ras-cas) ras to cas delay time 20 -- ns t wl(cas) cas pulse width low 20 -- ns t cy(cas) cas page mode cycle time 50 -- ns t pch(cas) cas precharge time 10 -- ns t h(cas-ras) ras hold time after cas 20 -- ns t pch(cas-ras) cas to ras precharge time 10 -- ns t su(ra) row address set-up time 0 -- ns t h(ra) row address hold time 10 -- ns t su(ca) column address set-up time 0 -- ns t h(ca) column address hold time 15 -- ns t su(r) read command set-up time 0 -- ns t h(r)(cas) read command hold time from ( cas) 0 -- ns t h(r)(ras) read command hold time from ( ras) 10 -- ns t su(w) write command set-up time 0 -- ns t h(w) write command hold time 15 -- ns t su(i)(d) data input set-up time 0 -- ns t h(i)(d) data input hold time 15 -- ns t acc(r)(cas) read access time from ( cas) -- 20 ns t acc(r)(ras) read access time from ( ras) -- 80 ns
1997 may 16 16 philips semiconductors preliminary speci?cation chinese character system teletext (ccst) decoder saa5700 fig.4 dram interface timing. handbook, full pagewidth mgg542 t rp t rsh t csh t pc t cas t cah t cp t rrh t rch t rcs read cycle write cycle rd in rd out ras cas address we t cyc t rcd t asr t rah t asc t cac t rac t wcs t wch t ds t dh we
1997 may 16 17 philips semiconductors preliminary speci?cation chinese character system teletext (ccst) decoder saa5700 application information fig.5 application diagram. d7 to d4 d3 to d0 handbook, full pagewidth mgg540 oscin oscout 10 k w 100 k w 75 w 100 nf 100 nf 100 nf 100 nf 100 nf 100 nf 100 nf 100 nf 22 pf 22 pf 6 mhz v ss3 v ssa i ref cvbs stn ref + black v dda 9 4 10 6 7 8 5 2 1 64 cvbs front end lfb hsync vsync rgb ground ffb r/g/b/blan r/g/b/blan v sso odd/even odd/even 25 20 21 to 24 18 17 tv display sda scl 61 62 i 2 c-bus to microcontroller reset reset v ss v ss v ss 14 59 16 26 27 35 33 19 v ddd1 v ss1 v ddx +5 v + 5 v 0 v + 5 v dcl dda 63 60 v ddd2 v ss2 we cas ras rd3 to rd0 ra0 to ra10 v dd v ss we cas ras d3 to d0 a10 to a0 48 49 44 53 42 52, 51, 47, 46 28 to 32, 36 to 38, 40,41,54 dram oe 0 v 74ls573 di rd7 to rd4 55 to 58 oe oe ce en v dd v ss + 5 v + 5 v + 5 v rom 0 v 0 v 0 v 0 v saa5700 crystal oscillator romcs do a18 to a0
1997 may 16 18 philips semiconductors preliminary speci?cation chinese character system teletext (ccst) decoder saa5700 package outline unit a 1 a 2 a 3 b p ce (1) eh e ll p qz y w v q references outline version european projection issue date iec jedec eiaj mm 0.25 0.05 2.90 2.65 0.25 0.50 0.35 0.25 0.14 14.1 13.9 1 18.2 17.6 1.4 1.2 1.2 0.8 7 0 o o 0.2 0.1 0.2 1.95 dimensions (mm are the original dimensions) note 1. plastic or metal protrusions of 0.25 mm maximum per side are not included. 1.0 0.6 sot319-2 92-11-17 95-02-04 d (1) (1) (1) 20.1 19.9 h d 24.2 23.6 e z 1.2 0.8 d e q e a 1 a l p q detail x l (a ) 3 b 19 y c e h a 2 d z d a z e e v m a 1 64 52 51 33 32 20 x pin 1 index b p d h b p v m b w m w m 0 5 10 mm scale qfp64: plastic quad flat package; 64 leads (lead length 1.95 mm); body 14 x 20 x 2.8 mm sot319-2 a max. 3.20
1997 may 16 19 philips semiconductors preliminary speci?cation chinese character system teletext (ccst) decoder saa5700 soldering introduction there is no soldering method that is ideal for all ic packages. wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. however, wave soldering is not always suitable for surface mounted ics, or for printed-circuits with high population densities. in these situations reflow soldering is often used. this text gives a very brief insight to a complex technology. a more in-depth account of soldering ics can be found in our ic package databook (order code 9398 652 90011). re?ow soldering reflow soldering techniques are suitable for all qfp packages. the choice of heating method may be influenced by larger plastic qfp packages (44 leads, or more). if infrared or vapour phase heating is used and the large packages are not absolutely dry (less than 0.1% moisture content by weight), vaporization of the small amount of moisture in them can cause cracking of the plastic body. for more information, refer to the drypack chapter in our quality reference handbook (order code 9397 750 00192). reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. several techniques exist for reflowing; for example, thermal conduction by heated belt. dwell times vary between 50 and 300 seconds depending on heating method. typical reflow temperatures range from 215 to 250 c. preheating is necessary to dry the paste and evaporate the binding agent. preheating duration: 45 minutes at 45 c. wave soldering wave soldering is not recommended for qfp packages. this is because of the likelihood of solder bridging due to closely-spaced leads and the possibility of incomplete solder penetration in multi-lead devices. if wave soldering cannot be avoided, the following conditions must be observed: a double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. the footprint must be at an angle of 45 to the board direction and must incorporate solder thieves downstream and at the side corners. even with these conditions, do not consider wave soldering the following packages: qfp52 (sot379-1), qfp100 (sot317-1), qfp100 (sot317-2), qfp100 (sot382-1) or qfp160 (sot322-1). during placement and before soldering, the package must be fixed with a droplet of adhesive. the adhesive can be applied by screen printing, pin transfer or syringe dispensing. the package can be soldered after the adhesive is cured. maximum permissible solder temperature is 260 c, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 c within 6 seconds. typical dwell time is 4 seconds at 250 c. a mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. repairing soldered joints fix the component by first soldering two diagonally- opposite end leads. use only a low voltage soldering iron (less than 24 v) applied to the flat part of the lead. contact time must be limited to 10 seconds at up to 300 c. when using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 c.
1997 may 16 20 philips semiconductors preliminary speci?cation chinese character system teletext (ccst) decoder saa5700 definitions life support applications these products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify philips for any damages resulting from such improper use or sale. purchase of philips i 2 c components data sheet status objective speci?cation this data sheet contains target or goal speci?cations for product development. preliminary speci?cation this data sheet contains preliminary data; supplementary data may be published later. product speci?cation this data sheet contains ?nal product speci?cations. limiting values limiting values given are in accordance with the absolute maximum rating system (iec 134). stress above one or more of the limiting values may cause permanent damage to the device. these are stress ratings only and operation of the device at these or at any other conditions above those given in the characteristics sections of the speci?cation is not implied. exposure to limiting values for extended periods may affect device reliability. application information where application information is given, it is advisory and does not form part of the speci?cation. purchase of philips i 2 c components conveys a license under the philips i 2 c patent to use the components in the i 2 c system provided the system conforms to the i 2 c specification defined by philips. this specification can be ordered using the code 9398 393 40011.
1997 may 16 21 philips semiconductors preliminary speci?cation chinese character system teletext (ccst) decoder saa5700 notes
1997 may 16 22 philips semiconductors preliminary speci?cation chinese character system teletext (ccst) decoder saa5700 notes
1997 may 16 23 philips semiconductors preliminary speci?cation chinese character system teletext (ccst) decoder saa5700 notes
internet: http://www.semiconductors.philips.com philips semiconductors C a worldwide company ? philips electronics n.v. 1997 sca54 all rights are reserved. reproduction in whole or in part is prohibited without the prior written consent of the copyright owne r. the information presented in this document does not form part of any quotation or contract, is believed to be accurate and reli able and may be changed without notice. no liability will be accepted by the publisher for any consequence of its use. publication thereof does not con vey nor imply any license under patent- or other industrial or intellectual property rights. netherlands: postbus 90050, 5600 pb eindhoven, bldg. vb, tel. +31 40 27 82785, fax. +31 40 27 88399 new zealand: 2 wagener place, c.p.o. box 1041, auckland, tel. +64 9 849 4160, fax. +64 9 849 7811 norway: box 1, manglerud 0612, oslo, tel. +47 22 74 8000, fax. +47 22 74 8341 philippines: philips semiconductors philippines inc., 106 valero st. salcedo village, p.o. box 2108 mcc, makati, metro manila, tel. +63 2 816 6380, fax. +63 2 817 3474 poland: ul. lukiska 10, pl 04-123 warszawa, tel. +48 22 612 2831, fax. +48 22 612 2327 portugal: see spain romania: see italy russia: philips russia, ul. usatcheva 35a, 119048 moscow, tel. +7 095 755 6918, fax. +7 095 755 6919 singapore: lorong 1, toa payoh, singapore 1231, tel. +65 350 2538, fax. +65 251 6500 slovakia: see austria slovenia: see italy south africa: s.a. philips pty ltd., 195-215 main road martindale, 2092 johannesburg, p.o. box 7430 johannesburg 2000, tel. +27 11 470 5911, fax. +27 11 470 5494 south america: rua do rocio 220, 5th floor, suite 51, 04552-903 s?o paulo, s?o paulo - sp, brazil, tel. +55 11 821 2333, fax. +55 11 829 1849 spain: balmes 22, 08007 barcelona, tel. +34 3 301 6312, fax. +34 3 301 4107 sweden: kottbygatan 7, akalla, s-16485 stockholm, tel. +46 8 632 2000, fax. +46 8 632 2745 switzerland: allmendstrasse 140, ch-8027 zrich, tel. +41 1 488 2686, fax. +41 1 481 7730 taiwan: philips semiconductors, 6f, no. 96, chien kuo n. rd., sec. 1, taipei, taiwan tel. +886 2 2134 2865, fax. +886 2 2134 2874 thailand: philips electronics (thailand) ltd., 209/2 sanpavuth-bangna road prakanong, bangkok 10260, tel. +66 2 745 4090, fax. +66 2 398 0793 turkey: talatpasa cad. no. 5, 80640 gltepe/istanbul, tel. +90 212 279 2770, fax. +90 212 282 6707 ukraine : philips ukraine, 4 patrice lumumba str., building b, floor 7, 252042 kiev, tel. +380 44 264 2776, fax. +380 44 268 0461 united kingdom: philips semiconductors ltd., 276 bath road, hayes, middlesex ub3 5bx, tel. +44 181 730 5000, fax. +44 181 754 8421 united states: 811 east arques avenue, sunnyvale, ca 94088-3409, tel. +1 800 234 7381 uruguay: see south america vietnam: see singapore yugoslavia: philips, trg n. pasica 5/v, 11000 beograd, tel. +381 11 625 344, fax.+381 11 635 777 for all other countries apply to: philips semiconductors, marketing & sales communications, building be-p, p.o. box 218, 5600 md eindhoven, the netherlands, fax. +31 40 27 24825 argentina: see south america australia: 34 waterloo road, north ryde, nsw 2113, tel. +61 2 9805 4455, fax. +61 2 9805 4466 austria: computerstr. 6, a-1101 wien, p.o. box 213, tel. +43 1 60 101, fax. +43 1 60 101 1210 belarus: hotel minsk business center, bld. 3, r. 1211, volodarski str. 6, 220050 minsk, tel. +375 172 200 733, fax. +375 172 200 773 belgium: see the netherlands brazil: see south america bulgaria: philips bulgaria ltd., energoproject, 15th floor, 51 james bourchier blvd., 1407 sofia, tel. +359 2 689 211, fax. +359 2 689 102 canada: philips semiconductors/components, tel. +1 800 234 7381 china/hong kong: 501 hong kong industrial technology centre, 72 tat chee avenue, kowloon tong, hong kong, tel. +852 2319 7888, fax. +852 2319 7700 colombia: see south america czech republic: see austria denmark: prags boulevard 80, pb 1919, dk-2300 copenhagen s, tel. +45 32 88 2636, fax. +45 31 57 0044 finland: sinikalliontie 3, fin-02630 espoo, tel. +358 9 615800, fax. +358 9 61580920 france: 4 rue du port-aux-vins, bp317, 92156 suresnes cedex, tel. +33 1 40 99 6161, fax. +33 1 40 99 6427 germany: hammerbrookstra?e 69, d-20097 hamburg, tel. +49 40 23 53 60, fax. +49 40 23 536 300 greece: no. 15, 25th march street, gr 17778 tavros/athens, tel. +30 1 4894 339/239, fax. +30 1 4814 240 hungary: see austria india: philips india ltd, shivsagar estate, a block, dr. annie besant rd. worli, mumbai 400 018, tel. +91 22 4938 541, fax. +91 22 4938 722 indonesia: see singapore ireland: newstead, clonskeagh, dublin 14, tel. +353 1 7640 000, fax. +353 1 7640 200 israel: rapac electronics, 7 kehilat saloniki st, po box 18053, tel aviv 61180, tel. +972 3 645 0444, fax. +972 3 649 1007 italy: philips semiconductors, piazza iv novembre 3, 20124 milano, tel. +39 2 6752 2531, fax. +39 2 6752 2557 japan: philips bldg 13-37, kohnan 2-chome, minato-ku, tokyo 108, tel. +81 3 3740 5130, fax. +81 3 3740 5077 korea: philips house, 260-199 itaewon-dong, yongsan-ku, seoul, tel. +82 2 709 1412, fax. +82 2 709 1415 malaysia: no. 76 jalan universiti, 46200 petaling jaya, selangor, tel. +60 3 750 5214, fax. +60 3 757 4880 mexico: 5900 gateway east, suite 200, el paso, texas 79905, tel. +9-5 800 234 7381 middle east: see italy printed in the netherlands 547047/50/01/pp24 date of release: 1997 may 16 document order number: 9397 750 01008

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